PCB standard of LED module

General printing board used baseplate material can be divided into 2 types: Rigidity baseplate and flexibility baseplate. an important type rigidity baseplate is CCL, it uses reinforeing material with resin adhesive, via drying, cutting, mounted into blank, then covered with copper foil, using steel plate as molding, coming into formed by high temperature and high pressure in 
hot press. the general composite board used prepreg, is the semi-finished  CCL when processing(mainly glass cloth soaked with resin, with drying process).

PCB standard of LED module

There are many sorting methods forCCP(copper clad plate).generally if according to different reinforcingmaterial, can divided into: paper base, fiberglass fabric base, combined base（CEM series）,laminated,multilayer base and special material base(ceramic, metal….) and so on 5categories. If according to different type plate used resin adhesive, usualpaper base CCI include:Phenol-formaldehyde resin(XPc、XxxPC、FR一1、FR一2etc)、Epoxy resin(FE一3) 、Polyesterresin and so on types. Usual fiberglass fabric base CCL is Epoxy resin(FR一4、FR一5),this is the most common .Besides ,Thereare other special resin(use fiberglass fabric ,poly amide fiber, nonwovens asstrengthen material):BT, PI, PPO, MS, poly cyanic acid resin, polyolefin resinetc.

If according to flame retardation, it can be divided into antiflaming (UL94一VO、UL94一V1 level ) and unantiflaming (UL94一HB level).In current 2 years, with the eco-friendly becoming more and more important, there is a new CCL type which doesn’t include bromine, it can be called”green flame retardation CCL” with the highly speed development of electronics ,the requirement for CCL becomes higher. So, according to the performance of CCL, it can be divided into General performance CCL, low-k CCL, high thermostability CCL(normal ones is higher than 150℃),low CTE CCL(generally used on package substrate )etc.

The highly developing electronic market raise new demands for PCB base, this push the development of copper-clad plate standard. Currently, below are the main standard for baseplate material:

1)      National standard. Right now in china, relevant standard include GB／T4721—4722 1992 and GB 4723—4725—1992,for Taiwan is CNS standard which drawn up to JIS Japan, publish in 1983.

2)      Standards in some other countries:

JIS(Japan); 

ASTM,NEMA, MIL, Ipc, ANSI,UL(US);

BS(UK);

DIN,VDE(Germany);

NFC,UTE(France);

CSA(Canada);

AS(Australia);

FOCT(FSU);

IEC(International standard).

Some standard name and department that set the standard:

JIS-Japan Industrial Standards- Japan Standards Association
ASTM -American Society fof Testi’ng and Materials 
NEMA- -Nafiomll Electrical Manufactures A~ociation- 
MH- -Department of Defense Military Specific tions and Standards 
IPC- -The Institrue for Interoonnecting and packing EIectronics Circuits 
ANSl- -American National Standard Institute